Unick Silicone Heat Transfer Compound
Temperature range: -200°C to 130°C Thermal conductivity: 0.9W⁄mK • The Unick Silicone Heat Transfer Compound is a grease-like silicone material that is heavily impregnated with heat conductive metal oxides (zinc oxide). This combination of base and fillers produces a material that has a high thermal conductivity. Together with low bleed properties, the compound facilitates heat transfer from semiconductors to heat sinks by covering and smoothening pits and lands along the metal surfaces, thereby transferring heat uniformly and efficiently away from those surfaces and avoiding the development of hotspots.
• Uses and application: The compound is applied to the base and mounting studs of transistors, power diodes, CPUs and/or any component where excess heat is required to be drawn away. Ideally, this application should be done in a thin and uniform film without any break across the surface before coupling to a suitable metal heat sink is made.
This product was added to our catalog on Tuesday 03 October, 2023.
